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BGA Package Solder Paste DIP Turnkey PCB Assembly 700*460mm

Chengdu Cesgate Technology Co., Ltd
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BGA Package Solder Paste DIP Turnkey PCB Assembly 700*460mm

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Brand Name : CESGATE

Model Number : NA

Certification : UL、IATF16949、ISO9001

Place of Origin : China

MOQ : 1PCS( NO MOQ)

Price : Negotiable (Depends on your GERBER and BOM)

Payment Terms : T/T, L/C

Supply Ability : 13kk solding spot/day

Delivery Time : 3-7 working days

Packaging Details : PCB: Vacuum Packing / PCBA: ESD Packing

Product name : BGA Package Solder Paste One Stop Service SMT DIP Turnkey PCB Assembly Box Build

Feature : Solder Paste

SMT production line : 14

High-end equipment : FUJI NXT3/XPF laminator

Material : FR4/M4/M6/Rogers/TU872/IT968

Max Size Of Finish Board : 700*460mm

Test : AOI/SPI/XRAY/First Article Inspection

Min Space : 0.075mm

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BGA Package Solder Paste One Stop Service SMT DIP Turnkey PCB Assembly Box Build

Technical Requirement for turnkey pcb assembly

1) Professional Surface-mounting and Through-hole soldering Technology

2) Various sizes like 1206, 0805, 0603 components SMT technology

3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.

4) Turnkey PCB Assembly With CE, FCC, Rohs Approval

5) Nitrogen gas reflow soldering technology for SMT.

6) High Standard SMT&Solder Assembly Line

7) High density interconnected board placement technology capacity.

CESGATE SMT assembly welding quality control


1. The SMT line is equipped with high-end equipments, high-precision and high-yield processing
2. Quality inspection and control are carried out in each processing link to prevent defective products from flowing into the next link.
3. Equipped with a number of quality personnel throughout the sampling inspection.

Why choose CESGATE?

QUALITY


All PCBs are 100% electrical tested. They can pick and send PCBs to E-fixture test machines automatically, and place the PCBs at appointed places after testing, according to the test result;All PCBs are 100% visually inspected. All tests and inspect results are recorded in the inspection report and shipped together with the PCBs.

EXEPERIENCE


More than 10 years of experiences in the production of PCB.
Professional Engineer and oversea sales team in the PCB industry fully involved in the whole business procedures.Designed and manufactured various complex PCBs, which can meet all your design and manufacturing needs.

Equipment


More than 80% are automated production equipment, improves the production efficiency and product quality.And a variety of famous brand equipment is used in all processes, including Drilling, Electroless Plating, Electroplating, Etching, Solder Mask, Silk Screen, Chemical Gold, Electrolytic Gold, CNC Profiling,Electrical Testing, and Packing.

Price
Since we are directly operated by the factory, intermediate links are omitted. Secondly, we have a complete supply chain management system to control the cost of production, manufacturing and procurement sources. We will give you the cheapest purchase price to compare with other factories or manufacturers while ensuring good quality.

Specification

Article Description Capability
Material Laminate materials FR4, High TG FR4, High Frequency, Alum, FPC...
Board Cutting Number of layers 1-48
Min.thickness for inner layers
(Cu thickness are excluded)
0.003”(0.07mm)
Board Thickness Standard (0.1-4mm±10%)
Min. Single/Double:0.008±0.004”
4layer:0.01±0.008”
8layer:0.01±0.008”
Bow and twist no more than 7/1000
Copper Weight Outer Cu weight 0.5-4 0z
Inner Cu weight 0.5-3 0z
Drilling Min size 0.0078”(0.2mm)
Drill deviation ±0.002″(0.05mm)
PTH hole tolerance ±0.002″(0.005mm)
NPTH hole tolerance ±0.002″(0.005mm)
Solder Mask Color Green,white,black,red,blue…
Min solder mask clearanace 0.003″(0.07mm)
Thickness (0.012*0.017mm)
Silkscreen Color white,black,yellow,blue…
Min size 0.006″(0.15mm)
Max Size of Finish Board 700*460mm
Surface Finish HASL,ENIG,immersion silver,immersion tin,OSP…
PCB Outline Square,circle,irregular(with jigs)
Package QFN,BGA,SSOP,PLCC,LGA

BGA Package Solder Paste DIP Turnkey PCB Assembly 700*460mmBGA Package Solder Paste DIP Turnkey PCB Assembly 700*460mmBGA Package Solder Paste DIP Turnkey PCB Assembly 700*460mmBGA Package Solder Paste DIP Turnkey PCB Assembly 700*460mm

FAQ

Q: Are my files safe?
CEGSATE: Your files are kept very safe, and we are protecting intellectual property for our clients throughout the process. All files provided by customers are never shared with any third party.
Q: MOQ?
CESGATE: There is no MOQ in POE. We are able to flexibly handle small and large batches.
Q: Do you have any other services?
CESGATE: We mainly focus on the procurement services of PCB + assembly + components. In addition, we can also provide programming, testing, cable, housing assembly services.
Q: What is your inspection policy? How do you control the quality?
CESGATE: In order to ensure the quality of PCB products, flying probe inspection is usually used; electrical fixtures, automatic optical inspection (AOI), BGA parts x-ray inspection, first article inspection ( FAI) etc.
Q: What service do you have?
CESGATE: We provide turnkey solution including RD, PCB fabrication, SMT, final assembly,testing and other value-added service.

Product Tags:

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DIP PCB assembly 700*460mm

      
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